HSB02-101007

CUI Devices

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HSB02-101007

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HEAT SINK, BGA, 10 X 10 X 7 MM

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Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.275" (7.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	16.50°C/W @ 200 LFM
Length	0.394" (10.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	37.90°C/W
Material Finish	Black Anodized
Package	Box
Attachment Method	Adhesive
Width	0.394" (10.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	2.0W @ 75°C
Package Cooled	BGA