NCSWLF.031 1LB

Chip Quik Inc.

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NCSWLF.031 1LB

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Description:

LF SOLDER WIRE 96.5/3/0.5 TIN/SI

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Storage/Refrigeration Temperature	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Form	Spool, 1 lb (454 g)
Process	Lead Free
Product Status	Active
Wire Gauge	20 AWG, 21 SWG
Flux Type	No-Clean
Series	-
Type	Wire Solder
Shelf Life Start	-
Mfr	Chip Quik Inc.
Shelf Life	-
Package	Bulk
Melting Point	422 ~ 428°F (217 ~ 220°C)
Diameter	0.031" (0.79mm)
Base Product Number	NCSW