SEAFP-50-01-S-10-RA-WT-GP

Samtec Inc.

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.050" SEARAY HIGH-SPEED OPEN-PI

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Number of Rows	10
Number of Positions	500
Contact Finish Thickness	30.0µin (0.76µm)
Contact Finish	Gold
Height Above Board	-
Mounting Type	Through Hole, Right Angle, Press-Fit
Product Status	Active
Series	SEARAY™ SEAFP
Connector Type	High Density Array, Female
Mfr	Samtec Inc.
Pitch	0.050" (1.27mm)
Features	Board Guide, Solder Retention
Mated Stacking Heights	-
Package	Tray
Base Product Number	SEAFP-50