TS391LT50

Chip Quik Inc.

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TS391LT50

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Description:

THERMALLY STABLE SOLDER PASTE NO

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Storage/Refrigeration Temperature	68°F ~ 77°F (20°C ~ 25°C)
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Form	Jar, 1.76 oz (50g)
Process	Lead Free
Product Status	Active
Wire Gauge	-
Flux Type	No-Clean
Series	-
Type	Solder Paste
Mesh Type	4
Shelf Life Start	Date of Manufacture
Shipping Info	-
Mfr	Chip Quik Inc.
Shelf Life	12 Months
Package	Bulk
Melting Point	281°F (138°C)
Diameter	-
Base Product Number	TS391L