28-3552-10

Aries Electronics

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28-3552-10

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CONN IC DIP SOCKET ZIF 28POS TIN

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Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Current Rating (Amps)	1 A
Contact Finish Thickness - Mating	200.0µin (5.08µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Active
Number of Positions or Pins (Grid)	28 (2 x 14)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	55
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Aries Electronics
Features	Closed Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Termination Post Length	0.110" (2.78mm)
Contact Resistance	-
Package	Bulk
Base Product Number	28-3552