ACA-SPI-006-K01
LOTES
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제품 정보
매개 변수 정보
사용자 가이드
| Contact Finish - Mating | Gold |
| Operating Temperature | - |
| Contact Material - Post | Phosphor Bronze |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Contact Finish Thickness - Mating | 1.00µin (0.025µm) |
| Termination | Solder |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Surface Mount |
| Product Status | Active |
| Number of Positions or Pins (Grid) | 16 (2 x 8) |
| Contact Finish Thickness - Post | 1.00µin (0.025µm) |
| Pitch - Post | 0.050" (1.27mm) |
| Series | - |
| Type | SOIC |
| Contact Finish - Post | Gold |
| Mfr | LOTES |
| Features | Board Guide, Closed Frame |
| Contact Material - Mating | Phosphor Bronze |
| Pitch - Mating | 0.050" (1.27mm) |
| Termination Post Length | - |
| Contact Resistance | 30mOhm |
| Package | Tape & Reel (TR) |
2000+일일 평균 RFQ 볼륨
30,000,000표준 제품 단위
2800+전세계 제조 업체
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