DIP316-014BLF

Amphenol ICC (FCI)

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DIP316-014BLF

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설명:

CONN IC DIP SOCKET 16POS TIN

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Contact Finish - Mating	Tin
Operating Temperature	-
Contact Material - Post	Brass
Housing Material	Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Contact Finish Thickness - Mating	100.0µin (2.54µm)
Termination	Solder
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Product Status	Obsolete
Number of Positions or Pins (Grid)	16 (2 x 8)
Contact Finish Thickness - Post	200.0µin (5.08µm)
Pitch - Post	0.100" (2.54mm)
Series	-
Type	DIP, 0.3" (7.62mm) Row Spacing
Contact Finish - Post	Tin
Mfr	Amphenol ICC (FCI)
Features	Open Frame
Contact Material - Mating	Beryllium Copper
Pitch - Mating	0.100" (2.54mm)
Termination Post Length	0.125" (3.18mm)
Contact Resistance	-
Package	Bag
Base Product Number	DIP316