FI-TD50SB-E

JAE Electronics

제품 번호:

FI-TD50SB-E

제조업체:

패키지:

배치:

데이터 시트:

설명:

CONN RCPT 50POS 0.05 GOLD SMD

수량:

배달:

지불:

재고 : 문의 해주세요

RFQ를 보내 주시면 즉시 응답하겠습니다.

연락처 이름

이메일

회사 이름

국가

수량

Insulation Height	0.110" (2.79mm)
Ingress Protection	-
Voltage Rating	-
Contact Finish Thickness - Mating	30.0µin (0.76µm)
Current Rating (Amps)	0.5A per Contact
Contact Type	Center Strip Contact
Material Flammability Rating	UL94 V-0
Product Status	Obsolete
Connector Type	Receptacle
Contact Material	Copper Alloy
Mfr	JAE Electronics
Style	Board to Cable/Wire
Features	Board Guide, Pick and Place, Solder Retention
Pitch - Mating	0.020" (0.50mm)
Contact Finish - Mating	Gold
Operating Temperature	-40°C ~ 85°C
Number of Rows	1
Applications	General Purpose
Number of Positions	50
Termination	Solder
Fastening Type	Latch Holder
Mounting Type	Surface Mount
Contact Finish Thickness - Post	-
Insulation Material	Thermoplastic
Series	FI-D
Contact Shape	-
Row Spacing - Mating	-
Insulation Color	Black
Contact Finish - Post	Tin
Contact Length - Post	-
Number of Positions Loaded	All
Mated Stacking Heights	4.5mm
Package	Bulk
Base Product Number	FI-TD50