FI-XB30SSLA-HF15

JAE Electronics

제품 번호:

FI-XB30SSLA-HF15

제조업체:

패키지:

배치:

데이터 시트:

설명:

CONN RCPT 30P 0.039 GOLD SMD R/A

수량:

배달:

지불:

재고 : 1441

최소: 1 곱셈: 1

Qty

단위 가격

Ext 가격

원하는 가격이 아닙니까? 지금 RFQ를 보내면 최대한 빨리 연락 드리겠습니다.

Insulation Height	-
Ingress Protection	-
Voltage Rating	200V
Contact Finish Thickness - Mating	3.90µin (0.099µm)
Current Rating (Amps)	1A per Contact
Contact Type	Non-Gendered
Material Flammability Rating	UL94 V-0
Product Status	Active
Connector Type	Receptacle
Contact Material	Copper Alloy
Mfr	JAE Electronics
Style	Board to Cable/Wire
Features	Grounding Pins, Shielded, Solder Retention
Pitch - Mating	0.039" (1.00mm)
Contact Finish - Mating	Gold
Operating Temperature	-40°C ~ 80°C
Number of Rows	1
Applications	General Purpose
Number of Positions	30
Termination	Solder
Fastening Type	Friction Lock
Mounting Type	Board Cutout, Bottom Mount, Surface Mount, Right Angle
Contact Finish Thickness - Post	-
Insulation Material	Plastic
Series	FI-X
Contact Shape	-
Row Spacing - Mating	-
Insulation Color	Beige
Contact Finish - Post	Tin
Contact Length - Post	-
Number of Positions Loaded	All
Mated Stacking Heights	-
Package	Tape & Reel (TR)
Base Product Number	FI-XB30