Chip Quik Inc.
Product No:
JET551SNL30T5
Manufacturer:
Package:
-
Batch:
-
Description:
JET PRINTING SOLDER PASTE SN96.5
Quantity:
Delivery:
Payment:
Please send RFQ , we will respond immediately.
Storage/Refrigeration Temperature | - |
Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
Form | Syringe, 3.53 oz (100g) |
Process | - |
Product Status | Active |
Wire Gauge | - |
Weight | - |
Flux Type | No-Clean |
Series | CHIPQUIK® |
Type | Solder Paste |
Shelf Life Start | Date of Manufacture |
Shipping Info | - |
Mfr | Chip Quik Inc. |
Shelf Life | 12 Months |
Package | Bulk |
Melting Point | 423 ~ 428°F (217 ~ 220°C) |
Diameter | - |